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resources:creating_pcbs_with_surface_mount_devices [2019/05/12 22:56] felix.h ↷ Page moved from creating_pcbs_with_surface_mount_devices to resources:creating_pcbs_with_surface_mount_devices |
resources:creating_pcbs_with_surface_mount_devices [2019/09/23 12:51] tggzzz |
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| ====Soldering==== | ====Soldering==== | ||
| For hand soldering, a temperature-controlled iron with a 0.5mm tip. I used the cheapest iron I could find, so I don't know the temperature, but it wasn't set at maximum. It is possible to solder all components by hand, which enables a board's function to be tested bit-by-bit, but it would be tedious for a second board. | For hand soldering, a temperature-controlled iron with a 0.5mm tip. I used the cheapest iron I could find, so I don't know the temperature, but it wasn't set at maximum. It is possible to solder all components by hand, which enables a board's function to be tested bit-by-bit, but it would be tedious for a second board. | ||
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| + | Be aware that touching ceramic components with a soldering iron can cause cracking through thermal stresses, and MLCCs have "exotic" dielectrics that can change at high temperature. | ||
| I also used a technique inspired by [[https://www.sparkfun.com/tutorials/59|SparkFun's reflow skillet method]]. Through hole components are left until later. I initially intended to use my slow cooker, but didn't reach the necessary temperature quickly enough, so instead: | I also used a technique inspired by [[https://www.sparkfun.com/tutorials/59|SparkFun's reflow skillet method]]. Through hole components are left until later. I initially intended to use my slow cooker, but didn't reach the necessary temperature quickly enough, so instead: | ||
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| I remove excess solder using a copper braid that I impregnate with liquid flux just before use. That seems to work, but one pad/track did begin to lift after I heated it up too much. | I remove excess solder using a copper braid that I impregnate with liquid flux just before use. That seems to work, but one pad/track did begin to lift after I heated it up too much. | ||
| - | I haven't tried the HackSpace's hot air gun, yet, but in theory that is gentler and better. | + | To remove a single component, surround other components with polyimide/kapton tape, and use a hot air gun. If positioned correctly, the tape will deflect the hot air away from surrounding components. |
| It is possible to reflow a second time, apparently without problems. | It is possible to reflow a second time, apparently without problems. | ||
- resources/creating_pcbs_with_surface_mount_devices
- Last modified: 9 months ago
- by tggzzz